 Custom's Packaging Capabilities include, but are not limited to;
Multi Component Assembly and Packaging:
Our modules are the perfect example of how we can package multiple, complex components into a single package effectively and efficiently. We are also experienced in packaging other pre-engineered systems. If you would like to take advantage of our multiple component assembly and packaging experience, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Prototype Development:
Custom has been in the prototype development arena since our inception in 1963. Since then, we have taken the concept "prototype development" to new levels. Custom even has a Prototype Team that Works with our R & D team. The collective experience of our engineers and technicians has allowed Custom to blaze new technology trails. If you have an electronic prototype that you need developed, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Contract Manufacturing:
Custom has been working on several projects that require assembly of pre-engineered products. Since we are fortunate to have some of the electronics industry's finest employees, we feel we can assist other companies with their manufacturing needs. Our 27,000-sq. ft. manufacturing facility and our broad experience gives Custom a decided advantage over other contract manufacturers. Using our assemblers, molders, testing technicians, research team, and engineering group, we can handle your most challenging contract requirements. If you would like more information, please contact Engineering Manager Chad Hall or Sales Manager Mike Schulte.
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Epoxy Potting and Encapsulation:
One of Custom's strengths is the ability to utilize specialized epoxy potting compounds and encapsulation materials. With combined experience of more than 120 years and a variety of compounds at their disposal, our molding technicians are experienced in assembling and potting complex molds. We also have a team that pours "Wrap and Fill" capacitors using a specialized epoxy in an open-pour environment. If you have an assembly that requires potting or encapsulation, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Silicone Potting:
Custom can also encapsulate components using silicone materials, which have advantages in high temperature environments. Our research technicians and engineers work together to find the proper potting material for every job. Custom's past experience, along with emerging technologies, help create the perfect setting for encapsulating your electronic assemblies. For questions about our silicone potting capabilities, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Plasma Etching :
 Custom has recently installed Plasma Etching capability in an effort to meet the surface cleaning and preparation requirements of our customers. Cleaning with Plasma Etch creates increased uniformity on any surface and will reduce or eliminate unwanted chemical waste. Our Plasma Etch chamber features an active processing surface with over 500 square inches of usable area. We can mix up to five gases to achieve the perfect environment for the proper etch, matched to each application. The Plasma Etch capability will help Custom Electronics prepare surfaces to achieve a high quality bond between the etched surface and the casting material used for encapsulation. For questions about our plasma etching capabilities, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Laser Marking:
Custom's laser marking capabilities have set us apart from competition. Performed by using a power laser to burn markings into a component's casing, laser marking is usually performed in applications designed for outer space. This marking technology allows us to perform logo, part number, variable data, date codes, and serial number insertions. If you have an application that requires this specialized marking, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Ink Jet Marking:
Custom uses a computer-controlled Ink Jet Marking system to perform complex marking operations on components of all shapes and sizes. Our ink meets government requirements and is continually checked for acceptability. If you have an application that requires ink jet marking, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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Subcontracting - Injection Molding:
If a specialized electronic component we build for you requires injection molding, Custom subcontracts the project to one of our local vendors. We have successfully used this process with our EFI units. Our vendors understand complex specifications and employ cutting-edge mold-making technologies and materials in this highly specialized area of work. To inquire about our injection molding solutions, please contact our sales department or visit our directory for a complete listing of our International Sales Representatives.
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